Polymatech Inks Deal with Japan's Orbray, Aims to Become End-to-End Chipmaker in India

Polymatech Electronics, India’s pioneer in opto-semiconductor chips, has inked a Memorandum of Understanding (MoU) with Japanese firm Orbray Co. Ltd, marking a pivotal step in the company’s vision to evolve into a “fully integrated, end-to-end semiconductor company”.

However, the partnership entails a comprehensive exchange, as Orbray will provide training to Polymatech Electronics engineers at its state-of-the-art facility in Japan. Furthermore, the Indian company has also finalised the procurement of sapphire ingot growing and wafer fabrication machinery, slated for installation by March 2025 at its Chennai facility.

Sapphire ingot technology is the process of growing large, high-quality crystals of sapphire (aluminium oxide) for use in the semiconductor industry.

Eswara Rao Nandam, Managing Director & CEO of Polymatech Electronics, remarked, “This is a historic day for us as we move closer to our company’s vision of becoming a ‘fully integrated, end-to-end semiconductor company’. This MoU will enable us to progress towards converting ingot into products, thereby entering the next level of our growth story.”

Orbray, an 85-year-old Japanese precision components manufacturer renowned globally, brings to the table a wealth of expertise in optical fibre components, Sapphire Wafers, and micro-motors, operating across various plants worldwide.

As of now, Polymatech Electronics has been India’s sole developer, producer, and packager of opto-semiconductor chips since 2019. Opto-semiconductor chips are tiny electronic devices that can either emit or detect light. They are made from special materials, like silicon or germanium, which can conduct electricity and interact with light in unique ways. There are two main types of opto-semiconductor chips, light-emitting diodes (LEDs), where the Tamil Nadu company has the major focus, and light-detecting devices.

With an expanding clientele spanning the US, EU, and MENA countries, the company boasts a current production capacity of 2,000 million chips. Polymatech Electronics manufactures these chips at its Oragadam, Tamil Nadu facility and has exported more than $125 million in the fiscal year 2023-24.

Polymatech Electronics specializes in designing, manufacturing, packaging, and assembling semiconductor chips and chip modules catering to diverse applications, including medical, agriculture, large-area lighting, PCs, laptops, and cell phone backlights.

Nandam said: “This is a considerable investment, and we will apply with the Government of India for capital subsidy under applicable schemes and respective state governments. Polymatech Electronics previously signed an MoU with the Government of Tamil Nadu on 27 May 2020.”

“We are also in advanced discussions with Silicon Carbide Wafer and Silicon Wafer fabrication machinery suppliers to accelerate our plans to become multi-wafer producers. As part of Polymatech Electronics initiative to make high-end semiconductor chips, we will supply all these wafers to companies entering the Indian market for packaging and other businesses,” he added.